Reactive Ion Etching and Related Polymerization Processes
The major technological potential of “dry etch” processing arises from the demonstrated control that can be exercised over the etch features even at a submicron resolution level. In addition, high selectivity through judicial choice of chemical etchants and type of radiation, as well as the compatibility with well established vacuum technology practices, further serve to promote several of the evolving dry etching approaches. With the growing importance of “radiation” induced processing technologies, such as reactive ion plasma etching and laser induced chemical etching and deposition, it has become necessary to understand the mechanisms whereby ions, photons and electrons influence surface chemical reactions. This review will emphasize the progress that has been made in understanding the role which ion-surface interactions play in increasing the rates of surface etching processes and how this relates to control over etch feature geometry.
KeywordsEtch Rate Carbonaceous Deposit Sticking Probability Etch Feature Isotropic Etching
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