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Evaluation of Thermal Contact Conductance by the Lumped Integral Formulation

  • N. W. Frush
  • R. A. Crane

Abstract

A new formulation has been developed which is capable of resolving a contact conductance coefficient when the transient temperature response is measured at selected points within a composite thermal system. The lumped integral approach is particularly attractive in that it leads to a rapid evaluation of a contact conductance coefficient with a minimum of sample preparation. The short measurement time is particularly useful when working with samples which are subject to thermal degradation. Integration of this approach to measurement configurations could be useful for generating data bases for analytical correlations, as well as evaluating contact conductance coefficients for unique engineering hardware configurations.

Keywords

Heat Sink Instantaneous Temperature Contact Conductance Solid Plate Thermal Contact Conductance 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    Arpaci, V., Conduction Heat Transfer, Addison-Wesley Publishing Company, London, 1966.Google Scholar
  2. 2.
    Frush, N. W., “Error Evaluation of Thermal Contact Conductance Using the Lumped Integral Formulation,” University of South Florida, Master’s Thesis, June 1981.Google Scholar

Copyright information

© Purdue Research Foundation 1983

Authors and Affiliations

  • N. W. Frush
    • 1
    • 2
  • R. A. Crane
    • 1
    • 2
  1. 1.Advanced Systems Engineering Sperry Gyroscope/ClearwaterClearwaterUSA
  2. 2.Energy Conversion DepartmentUniversity of South FloridaTampaUSA

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