Evaluation of Thermal Contact Conductance by the Lumped Integral Formulation
A new formulation has been developed which is capable of resolving a contact conductance coefficient when the transient temperature response is measured at selected points within a composite thermal system. The lumped integral approach is particularly attractive in that it leads to a rapid evaluation of a contact conductance coefficient with a minimum of sample preparation. The short measurement time is particularly useful when working with samples which are subject to thermal degradation. Integration of this approach to measurement configurations could be useful for generating data bases for analytical correlations, as well as evaluating contact conductance coefficients for unique engineering hardware configurations.
KeywordsHeat Sink Instantaneous Temperature Contact Conductance Solid Plate Thermal Contact Conductance
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