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Normal-superconducting (NS) boundaries may be fabricated directly, e.g. by evaporation of lead onto a copper foil, or as a stack of alternating N and S laminae in the intermediate state of a type I superconductor. The technique for achieving regularly stacked laminae, transverse to a long rod, is described by Walton (1965) and a typical curve for the thermal resistivity of tin obtained in this work is shown in Fig. 1. The fraction of normal material rises linearly with magnetic field, and so does the electrical resistance, indicating that N and S laminae behave as a chain of resistors in series, with no extra contribution from the boundaries. By contrast the thermal resistivity is dominated by the boundaries. As the temperature approaches Tc the thermal boundary resistance becomes less marked and at the same time a boundary contribution to the electrical resistance becomes apparent, as illustrated in Fig. 2 (Landau, 1970; Pippard et al., 1971).
KeywordsCopper Foil Evanescent Wave Normal Metal Phase Coherence Interface Resistance
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© Plenum Press, New York 1981