Particulate Removal in Microelectronics Manufacturing

  • D. A. Brandreth
  • R. E. JohnsonJr.


The ever-decreasing dimensions of microelectronic components emphasize the need for better cleaning solvents, equipment, and procedures. The fundamentals of particle adhesion to surfaces are discussed, and it is shown that solvents such as mixtures of ethanol or i-propanol with fluorocarbons such as trichloro-trifluoroethane significantly diminish particle-surface adhesion enough to allow removal of particles to the micron-level when used with intense agitation.


Adhesive Force Intermolecular Force Diamond Particle Particulate Removal Particle Adhesion 
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Copyright information

© Plenum Press, New York 1979

Authors and Affiliations

  • D. A. Brandreth
    • 1
  • R. E. JohnsonJr.
    • 1
  1. 1.E. I. du Pont de Nemours & CompanyWilmingtonUSA

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