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Particulate Removal in Microelectronics Manufacturing

  • D. A. Brandreth
  • R. E. JohnsonJr.

Abstract

The ever-decreasing dimensions of microelectronic components emphasize the need for better cleaning solvents, equipment, and procedures. The fundamentals of particle adhesion to surfaces are discussed, and it is shown that solvents such as mixtures of ethanol or i-propanol with fluorocarbons such as trichloro-trifluoroethane significantly diminish particle-surface adhesion enough to allow removal of particles to the micron-level when used with intense agitation.

Keywords

Adhesive Force Intermolecular Force Diamond Particle Particulate Removal Particle Adhesion 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    H. C. Hamaker, Physica, IV, 1058 (1937).Google Scholar
  2. 2.
    H. Krupp, Adv. Colloid Interface Sci. 1, 111 (1967).CrossRefGoogle Scholar
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    I. F. Stowers, J.Vac. Sci. Technol. 15, 751 (1978).CrossRefGoogle Scholar
  4. 4.
    S. Bhattacharya and K. L. Mittal, Surface Technol., 7, 413 (1978).CrossRefGoogle Scholar

Copyright information

© Plenum Press, New York 1979

Authors and Affiliations

  • D. A. Brandreth
    • 1
  • R. E. JohnsonJr.
    • 1
  1. 1.E. I. du Pont de Nemours & CompanyWilmingtonUSA

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