Cleaning has become a major issue in conjunction with the soldering process. Two major areas of cleanliness are discussed; pre-soldering and post soldering. The solder process itself can be simplified into a sequence of operations starting with surface preparation by the flux, heating, melting and wetting by the solder, and subsequent freezing. The efficiency of the flux thus depends on the amount of foreign materials present on the surface which may interfere with the intimate contact of the flux with the surface to be soldered. In this respect, contamination of the surfaces is often associated with solderability problems and the inability of fluxes to perform their function properly.
KeywordsSoldering Process Surface Contamination Conformal Coating Volatile Organic Solvent Volatile Organic Chemical
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