Surface Contamination Removal from Solid State Devices by Dry Chemical Processing

  • H. B. Bonham
  • P. V. Plunkett


Many authors have discussed the detrimental results of surface contamination upon thermocompression bondability. The problem is acute when gold-aluminum intraconnections are formed, since most wet chemical cleaning procedures degrade bondability further because of residual contamination. This paper discusses the dry chemical approach of plasma cleaning to remove organic contamination from aluminum surfaces.


Bond Yield Organic Contamination Resistor Stability Cleaning Time Plasma Cleaning 
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Copyright information

© Plenum Press, New York 1979

Authors and Affiliations

  • H. B. Bonham
    • 1
    • 2
  • P. V. Plunkett
    • 1
  1. 1.Sandia LaboratoriesAlbuquerqueUSA
  2. 2.Electronic Systems GroupRockwell InternationalDallasUSA

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