Abstract
Many authors have discussed the detrimental results of surface contamination upon thermocompression bondability. The problem is acute when gold-aluminum intraconnections are formed, since most wet chemical cleaning procedures degrade bondability further because of residual contamination. This paper discusses the dry chemical approach of plasma cleaning to remove organic contamination from aluminum surfaces.
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References
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LFE Data Sheet, Bulletin No. 8203-PBI, LFE Corporation, Process control Division, Waltham, MA, February 1974.
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D. F. O’Kane and K. L. Mittal, J. Vac. Sci. and Tech., 567, 1974.
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© 1979 Plenum Press, New York
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Bonham, H.B., Plunkett, P.V. (1979). Surface Contamination Removal from Solid State Devices by Dry Chemical Processing. In: Mittal, K.L. (eds) Surface Contamination. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-3506-1_18
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DOI: https://doi.org/10.1007/978-1-4684-3506-1_18
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4684-3508-5
Online ISBN: 978-1-4684-3506-1
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