Decomposition of Hydrogen Peroxide Cleaning Solutions by Selectively Plated Leadframes and Its Implications with Respect to Circuit Yield
Hydrogen peroxide is used extensively for cleaning electrical circuits because of its ability to oxidize a large number of inorganic and organic materials. During the pre-encapsulation cleaning of thin film integrated circuits assembled with selectively plated leadframes, sporadic violent hydrogen peroxide decomposition has been experienced. In addition, particles of metal have been noted in the peroxide bath after cleaning. The objectives of this work are: 1) to identify factors which influence the catalytic decomposition of the peroxide; 2) to establish to what extent the decomposition can be associated with selectively plated lead-frames; 3) to determine if circuit yields are affected by the particles.
KeywordsDecomposition Rate Auger Electron Spectroscopy Catalytic Decomposition Circuit Yield Peroxide Decomposition
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