Skip to main content

Electronic Ceramics: Promises Toward Solutions

  • Chapter
Ceramic Engineering and Science

Part of the book series: Materials Science Research ((MSR,volume 8))

  • 191 Accesses

Abstract

Electronic ceramics are already a major part of the technical ceramics industry. This may not seem surprising until it is realized that 25 years ago few could have predicted the existence or significance of the term “electronic ceramics.” Of course, the growth of the electronics industry with all its amazing new technology would have been even more difficult to predict. The growth of microelectronics technology has obviously created demands for ceramic materials in shapes and specifications previously unknown.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

eBook
USD 16.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. H. J. Nolte and R. F. Spurck, “Metallizing and Ceramic Sealing With Manganese” Television Eng$11, 14–18, 39 (Nov$11950) U. S. Patents 2,667,432 and 2,667, 427 (Jan. 1954)

    Google Scholar 

  2. A. J. Chick and L. J. Speck, “Fabrication and Metal-to- Ceramic Seals” U. S. Patent 2,708,787 (May 24, 1955 )

    Google Scholar 

  3. G. N. Howatt, R. C. Breckenbridge and J. M. Brownlow, “Fabrication of Thin Ceramic Sheets for Capacitors” J.Amer.Ceram. Soc. 30 (8) 237–42 (1947)

    Article  CAS  Google Scholar 

  4. H. W. Stetson and W. J. Gyurk, “Development of Two Micro- inch (CLA) As-Fired Alumina Substrate” Presented at the 69th Annual Meeting American Ceramic Society, New York 1967

    Google Scholar 

  5. R. F. Spurck, “Electrical Component Package” U. S. Patent No. 3, 700, 788

    Google Scholar 

  6. G. Rossi and J. E. Burke, “Influence of Additives on the Microstructure of Sintered A12O3 ” J.Amer.Ceram.Soc. Vol. 56, No. 12 November 1973.

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 1974 Plenum Press, New York

About this chapter

Cite this chapter

Fenerty, M.J., Hellicar, N.J. (1974). Electronic Ceramics: Promises Toward Solutions. In: Fréchette, V.D., Pye, L.D., Reed, J.S. (eds) Ceramic Engineering and Science. Materials Science Research, vol 8. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-3147-6_15

Download citation

  • DOI: https://doi.org/10.1007/978-1-4684-3147-6_15

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4684-3149-0

  • Online ISBN: 978-1-4684-3147-6

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics