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Nonbasal Slip in Alumina at High Temperatures and Pressures

  • Conference paper
Ceramics in Severe Environments

Part of the book series: Materials Science Research ((MSR,volume 5))

Abstract

Czochralski (0°) sapphire has been deformed in tensile creep at 1600–1800°C., and fine-grained alumina polycrystals have been deformed under hydrostatic confining pressure at 1000–1200°C., in order to activate nonbasal deformation modes. The tensile creep data is in agreement with Nabarro-climb, although evidence for pyramidal slip on the {1102} planes was also observed. Either of these deformation modes, in conjunction with basal and prismatic plane slip, permit general deformation of polycrystalline specimens. In addition, “water weakening” was observed to occur in the deformation of polycrystalline alumina under hydrostatic confining pressures.

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Author information

Author notes

  1. J. Tullis

    Present address: Brown University, Providence, R. I., USA

Authors and Affiliations

  1. Case Western Reserve University, Cleveland, Ohio, USA

    A. H. Heuer & R. F. Firestone

  2. Ferro Corporation, Cleveland, Ohio, USA

    J. D. Snow

  3. University of California at Los Angeles, Los Angeles, California, USA

    J. Tullis

Authors
  1. A. H. Heuer
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  2. R. F. Firestone
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  3. J. D. Snow
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  4. J. Tullis
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Editor information

Editors and Affiliations

  1. Department of Materials Engineering, North Carolina State University, USA

    Wurth W. Kriegel

  2. Department of Engineering Research, North Carolina State University, USA

    Hayne Palmour III

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© 1971 Plenum Press, New York

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Heuer, A.H., Firestone, R.F., Snow, J.D., Tullis, J. (1971). Nonbasal Slip in Alumina at High Temperatures and Pressures. In: Kriegel, W.W., Palmour, H. (eds) Ceramics in Severe Environments. Materials Science Research, vol 5. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-3141-4_22

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  • DOI: https://doi.org/10.1007/978-1-4684-3141-4_22

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4684-3143-8

  • Online ISBN: 978-1-4684-3141-4

  • eBook Packages: Springer Book Archive

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