The Use of Difference Thermocouples in Cryogenic Systems

  • S. C. Fan
Conference paper
Part of the Advances in Cryogenic Engineering book series (ACRE, volume 18)


Thermocouple circuits [1,2] vary widely, depending on their particular application. The circuit most commonly used for multiple thermocouple applications, as shown in Fig. 1, incorporates a single reference junction located outside of the process column. This conventional design approach will be compared with a “difference thermocouple” technique in this presentation, and a laboratory test using this improved system for cryogenic measurement will be described.


Lead Wire Normal bOiling Point Cryogenic System Liquid Nitrogen Storage Reference Junction 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. 1.
    R. B. Scott, Cryogenic Engineering, D. Van Nostrand Company, Princeton, New Jersey (1959), pp. 119–128.Google Scholar
  2. 2.
    R. E. Wilson and J. P. Evens, in: Process Instruments and Controls Handbook (D. M. Considine, editorin-chief), McGraw-Hill Book Company, New York (1957), pp. 2–5 to 2–20 and 12–78 to 12–88.Google Scholar
  3. 3.
    D. I. Finch, General Principles of Thermoelectric Thermometry, Leeds & Northrup Company, Philadelphia, Pennsylvania (1968).Google Scholar
  4. 4.
    S. C. Fan, J. C. Chu, and L. E. Scott, in: Advances in Cryogenic Engineering, Vol, 14, Springer Science+Business Media New York (1969), p. 249.Google Scholar
  5. 5.
    S. C. Fan, Ph.D. Dissertation, Polytechnic Institute of Brooklyn, Brooklyn, New York (1967).Google Scholar

Copyright information

© Springer Science+Business Media New York 1973

Authors and Affiliations

  • S. C. Fan
    • 1
  1. 1.Commonwealth Associates Inc.JacksonUSA

Personalised recommendations