Epoxy Resins as Cryogenic Structural Adhesives

  • R. M. McClintock
  • M. J. Hiza
Part of the Advances in Cryogenic Engineering book series (ACRE, volume 3)


This investigation of copper to copper bonds using filled epoxy resins as adhesives was undertaken to provide design information for a liquid hydrogen cooled electromagnet. It was proposed that the adjacent coils of the magnet be spaced with an epoxy resin adhesive which would provide structural rigidity as well as electrical insulation at the operating temperature of 20°K (-253°C). Since the completed coil would be acted upon by thermal stresses and electrical reaction forces, the present program was undertaken to evaluate the mechanical strength of several adhesives subjected to treatment corresponding to use in the end application.


Shear Strength Impact Strength Adhesive Bond Glue Line Shear Specimen 
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  1. 1.
    G. W. Koehn, Adhesion and Adhesives Fundamentals and Practice, John Wiley and Sons, Inc., New York, New York (1954).Google Scholar
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    N. A. de Bruyne, J. Appl. Chem., 6, 303 (1956).CrossRefGoogle Scholar
  3. 3.
    G. Epstein, Adhesive Bonding of Metals, Reinhold Publishing Corporation, New York, New York (1954).Google Scholar

Copyright information

© Plenum Press, Inc., New York 1960

Authors and Affiliations

  • R. M. McClintock
    • 1
  • M. J. Hiza
    • 1
  1. 1.CEL National Bureau of StandardsBoulderUSA

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