Properties of Simultaneously Sputtered Thin Metal Films
The physical properties of thin single-metal, bimetal, and multimetal films were studied. The thin films were deposited on glass substrates by the cathodic sputtering method. Bimetal or multimetal films were sputtered simultaneously, using a specially designed multilayer cathode. The effect of sputtered carbon on the properties of the single or multimetal films was tested using an additional cathode. Techniques included visual examination of color changes, electron microscopy and diffraction, and electrical resistivity. Some of the bimetal films showed no alloying at room temperature, exhibiting the structure of the metal with higher sputtering rate. Most of the multimetal films exhibited properties differing from those of the constituting metals. Carbon sputtered with single and multimetals (although having a low sputtering rate) showed changes in structure and in crystal shape and size in the sputtered films. Although the substrate temperature increased during sputtering its temperature was lower than the melting point of the sputtered metals. Studies of the alloying of multi-metal films indicated that alloying occured during preparation and at temperatures much lower than the recrystallization temperature of any of the metals involved.
KeywordsDiffraction Pattern Electrical Resistivity Substrate Temperature Electrical Resistivity Measurement Recrystallization Temperature
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