Manufacture of an Integrated Circuit Package

  • Horace Pops


Many techniques have been used to produce integrated circuit packages. All of these assembly methods, such as beam lead, spider, flip chip and others require a large number of separate and distinct processing steps, frequently causing high costs and poor reliability (1). In the chip and wire process, for example, a large number of very fine aluminum lead wires are bonded by ultrasonic cold welding to pads on the semiconductor chip, and in turn to tips of leads on the metal lead frame. Failure of the devise will occur if any of these bonds are defective.


Solder Bump Molten Solder Flip Chip Lead Frame Frame Member 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Springer Science+Business Media New York  1975

Authors and Affiliations

  • Horace Pops
    • 1
  1. 1.Essex International, Inc.Fort WayneUSA

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