Thin Film Interdiffusion of Chromium and Copper

  • J. E. E. Baglin
  • V. Brusic
  • E. Alessandrini
  • J. Ziegler

Abstract

Motivated by the need to understand the behavior of the Cr-Cu system in applications requiring high temperature annealing, we have examined the interdiffusion of thin overlaid Cr and Cu films at temperatures up to 750°C.

Keywords

Lateral Diffusion Bulk Diffusion Surface Peak Follow Heat Treatment Reflection Electron Diffraction 
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References

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    M. Hansen, ed. “Constitution of Binary Alloys”, McGraw-Hill, (New York), 1958; and R. Elliott, ed. (Supplement), 1965.Google Scholar
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    R. T. Whipple, Phil. Mag. 45, 1225 (1954).Google Scholar
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    D. Gupta, J. Appl. Phys. 44, 4455 (1973).CrossRefGoogle Scholar
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    G. Barreau, G. Brunei, G. Cizeron, Comptes Rendues Acad. Sci. (Paris) C272 618 (1971).Google Scholar

Copyright information

© Plenum Press, New York 1974

Authors and Affiliations

  • J. E. E. Baglin
    • 1
  • V. Brusic
    • 1
  • E. Alessandrini
    • 1
  • J. Ziegler
    • 1
  1. 1.IBM Thomas J. Watson Research CenterYorktown HeightsUSA

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