Abstract
We have implanted thin layers of silver bromide microcrystals with 1011 to 1014 silver, xenon, phosphorus, and cadmium ions per cm2, at energies from 30 to 225 keV, and used the intrinsic photosensitivity of the crystals to determine the effects of the implantation. Because of the unique properties of AgBr, which allow latent image formation by light and amplification of the image by chemical development, the effects of impurity ions on photocarrier trapping can be detected readily. Prior to implantation the microcrystals formed latent image only on the surface upon exposure to light. The spontaneous developability caused by ion bonibardment was removed by a bromination process. After implantation, bromination, and light exposure, the AgBr microcrystals showed reduced surface sensitivity and significant internal latent image for all of the ions studied. Evidently the implantation-induced defects controlled the photocarrier trapping. Proper annealing conditions for the elimination of the radiation damage caused by the high-energy ions were foxmd from the silver-implanted samples. After annealing, both cadmiuam and phosphorus controlled the photoelectron trapping and increased the internal photosensitivity of the microcrystals.
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References
For a discussion of the physics of the photographic process see “The Physics of Solids,” F. C. Brown, Benjamin, New York, 1967, Ch. 12.
H. E. Spencer and R. E. Atwell, J Opt. Soc. Amer., 54, 498, (1964) Note: The temperature was and the 60°C and 8.1, giving cubic instead of spherical grains, with no intentional chemical sensitization.
Similar to Kodak SWR (short-wave radiation) film described in Kodak Publication No. P-9, Eastman Kodak Company, Rochester, New York, I967.
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© 1973 Plenum Press, New York
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Kelly, T.M., Keevert, J.E., Helling, J.O., Merrigan, J.A. (1973). Ion Implantation in Silver Bromide. In: Crowder, B.L. (eds) Ion Implantation in Semiconductors and Other Materials. The IBM Research Symposia Series. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-2064-7_49
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DOI: https://doi.org/10.1007/978-1-4684-2064-7_49
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4684-2066-1
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