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Strain Induced Effects on EPR Centers in Silicon Generated By P+ Ion Implantation

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Book cover Ion Implantation in Semiconductors and Other Materials

Part of the book series: The IBM Research Symposia Series ((IRSS))

Abstract

Damage distribution in silicon generated by P+ ion implantation was measured by EPR method. It became clear that the peak position of the distribution of the paramagnetic defect center is always located at about 2/3 of the projected range Rp, where ΔHmsl of the signal begins to increase due to the release of the exchange narrowing effect. The g-value observed in the shorter depths than Rp was 2.0058 ± 0.0005 and is identical to that of the center in the amorphous region. At the stopping region of the implanted ions which is around Rp, an increase in the g-value was observed. It can be interpreted that strains caused by the stresses which the implanted ions exert on the surrounding lattice induce that effect.

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© 1973 Plenum Press, New York

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Matsumori, T., Kobayashi, T., Maekawa, H., Izumi, T. (1973). Strain Induced Effects on EPR Centers in Silicon Generated By P+ Ion Implantation. In: Crowder, B.L. (eds) Ion Implantation in Semiconductors and Other Materials. The IBM Research Symposia Series. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-2064-7_4

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  • DOI: https://doi.org/10.1007/978-1-4684-2064-7_4

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4684-2066-1

  • Online ISBN: 978-1-4684-2064-7

  • eBook Packages: Springer Book Archive

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