Effect of Chemical Cleaning Sequencing on Particle Addition/Reduction on Silicon Wafers
The purpose of this study was to determine what effects, if any, differing chemical sequences had on the particle levels of silicon wafers. The chemical solutions studied are: sulfuric acid, hydrogen peroxide mix (SPM); ammonium hydroxide, hydrogen peroxide, DI water mix (APM); hydrochloric acid, hydrogen peroxide, DI water mix (HPM); dilute hydrofluoric acid (DHF).
KeywordsSilicon Wafer Particle Count Particle Level Chemical Sequence Particle Performance
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