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Fine Particles on Semiconductor Surfaces: Sources, Removal and Impact on the Semiconductor Industry

  • Stuart A. Hoenig

Abstract

The impact of fine particles and organic contamination on device yield is very serious. We have investigated several technologies in this area. They include: 1) Application of thermophoresis for the prevention of surface contamination. 2) The use of electrets for collection of particles that might otherwise settle on surfaces. 3) The use of dry ice snow as a cleaning medium for the removal of particulates and organic contamination.

Keywords

Semiconductor Industry Clean Room Semiconductor Manufacturing Organic Vapor Permanent Dipole Moment 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Plenum Press, New York 1988

Authors and Affiliations

  • Stuart A. Hoenig
    • 1
  1. 1.Department of Electrical and Computer EngineeringUniversity of ArizonaTucsonUSA

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