Abstract
Significant improvements in condensation polyimide adhesives have been made by chemical modification of the diamine or dianhydride monomers, by use of copolymer composition and by use of a unique ether solvent as the polymerization medium. The effect on adhesive properties was studied and a family of adhesives developed whose bonding pressures (40-200 psi) and use temperature (up to 300°C) can be varied with composition to cover a wide range of practical applications. Alterations in the polymer backbone have also led to imidized films that have sufficient flow for possible use as film adhesives.
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© 1975 Plenum Press, New York
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St. Clair, T.L., Progar, D.J. (1975). Solvent and Structure Studies of Novel Polyimide Adhesives. In: Lee, LH. (eds) Adhesion Science and Technology. Polymer Science and Technology, vol 9. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-8201-4_13
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DOI: https://doi.org/10.1007/978-1-4615-8201-4_13
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4615-8203-8
Online ISBN: 978-1-4615-8201-4
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