Abstract
Polyimides possess high thermal stability, good barrier properties and resistance to solvents. Because of these properties these polymers are becoming attractive in electronic devices. This work describes the study of the curing of a commercial polyamic acid after thermal treatment, by using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and Infra-red spectroscopy to monitor the curing reaction leading to polyimide formation.
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© 1984 Springer Science+Business Media New York
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Navarre, M. (1984). Polyimide Thermal Analysis. In: Mittal, K.L. (eds) Polyimides. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-7637-2_29
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DOI: https://doi.org/10.1007/978-1-4615-7637-2_29
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4615-7639-6
Online ISBN: 978-1-4615-7637-2
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