Abstract
Cavities and microcracks occur in hot-pressed MgO doped and Y2O3 doped Si3N4 during high temperature creep. Specimens selected from static load experiments at 1200°C and 1300°C were examined by transmission electron microscopy. In the MgO doped Si3N4 an amorphous MgO · SiO2 phase, which bonded the grains, softened and cavitated readily at 1200°C leading to a creep exponent of 4.2. In the Y2O3 doped Si3N4 a crystalline yttrium-silica-oxynitride phase bonded the Si3N4 grains. Cavitation started at the triple junctions where these phases were present. Crack-like cavities also started at triple junctions and grew between the Si3N4 grains. The nucleation and growth stages of creep cavitation in both materials are related to failure mechanisms.
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© 1984 Plenum Press, New York
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Tighe, N.J., Wiederhorn, S.M., Chuang, TJ., McDaniel, C.L. (1984). Creep Cavitation and Crack Growth in Silicon Nitride. In: Tressler, R.E., Bradt, R.C. (eds) Deformation of Ceramic Materials II. Materials Science Research, vol 18. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-6802-5_39
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DOI: https://doi.org/10.1007/978-1-4615-6802-5_39
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