Abstract
Hot-pressed silicon nitride (HPSN), sintered silicon nitride and sialons form a class of high performance ceramics in which the highest strength values of today’s polycrystalline technical ceramics are found. Since their application is mostly related to high temperature engineering purposes, the material response on thermal and mechanical loading is of high practical and fundamental interest. It may especially be asked how the strength of these materials changes due to a long term application of load at high temperatures.
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© 1984 Plenum Press, New York
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Grathwohl, G. (1984). Regimes of Creep and Slow Crack Growth in High-Temperature Rupture of Hot-Pressed Silicon Nitride. In: Tressler, R.E., Bradt, R.C. (eds) Deformation of Ceramic Materials II. Materials Science Research, vol 18. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-6802-5_38
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DOI: https://doi.org/10.1007/978-1-4615-6802-5_38
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