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Mechanical Properties and Deformation Behavior of Nanostructured Ceramics

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Synthesis and Properties of Advanced Materials

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Abstract

In the search for improved mechanical properties, researchers have explored the region of finer and finer microstructural features in recent years. Much of the early interest in increasing the strength of polycrystalline materials by reducing the grain size arose from the Hall-Petch relationship [1,2] which indicates that the flow stress should be inversely proportional to the square root of the grain diameter. The original treatments of Hall and Petch were based on models of the stress concentration produced by a pileup of dislocations at a grain boundary.

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Author information

Authors and Affiliations

  1. Center for Materials Processing, University of Tennessee, Knoxville, TN, 37996-2350, USA

    Carl J. Mchargue

Authors
  1. Carl J. Mchargue
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Editor information

Editors and Affiliations

  1. Center for Materials Processing, University of Tennessee, Knoxville, TN, 37996-2350, USA

    Carl J. McHargue (Director, Professor) (Director, Professor)

  2. Materials Science and Engineering, University of Tennessee, Knoxville, TN, 37996-2350, USA

    Carl J. McHargue (Director, Professor) (Director, Professor)

  3. Yarmouth Port, MA, 02675-0655, USA

    J. B. Darby Jr.

  4. Instituto Nacional de Investigaciones Nucleares, Mexico

    Miguel José Yacamán (Director General) (Director General)

  5. Instituto de Fisica, Universidad Nacional Autonoma de Mexico, 01000, Mexico, D.F., Mexico

    José Reyes Gasga

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© 1997 Kluwer Academic Publishers

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Mchargue, C.J. (1997). Mechanical Properties and Deformation Behavior of Nanostructured Ceramics. In: McHargue, C.J., Darby, J.B., Yacamán, M.J., Gasga, J.R. (eds) Synthesis and Properties of Advanced Materials. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-6339-6_3

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  • DOI: https://doi.org/10.1007/978-1-4615-6339-6_3

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-7923-9816-5

  • Online ISBN: 978-1-4615-6339-6

  • eBook Packages: Springer Book Archive

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