Abstract

The work described in this book helped clarify the nature and importance of encapsulation stress, and how it can be predicted. However there are some issues still remaining which are outside the scope of this book but warrant further investigation.

Keywords

Mold Epoxy Brittle Shrinkage Encapsulation 

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. Blish, R. and Vaney, P. R. (1991). Failure rate model for thin film cracking in plastic ICs. In Proc. IEEE International Reliability Physics Symposium, pages 22–29.Google Scholar
  2. Cifuentes, A. O. and Shareef, I. A. (1992). Modelling of multilevel structures: A general method for analysing stress evolution during processing. IEEE Trans, on Semiconductor Manufacturing, 5(2):128–137.CrossRefGoogle Scholar
  3. Cifuentes, A. O. and Shareef, I. A. (1993). Some modelling issues in the finite element computation of thermal stress in metal lines. Trans. ASME Journal of Electronic Packaging, 115(4):392–403.CrossRefGoogle Scholar
  4. Foehringer, R., Golwalkar, S., Eskildsen, S., and Altimari, S. (1991). Thin film cracking in plastic packages-Analysis, model and improvements. In Proc. Electronic Components Conference, pages 759–765.Google Scholar
  5. Pao, Y., Jih, E., Artz, B. E., and Cathey, L. W. (1992). A note on the implementation of temperature dependent coefficient of thermal expansion (CTE) in ABAQUS. Trans. ASME Journal of Electronic Packaging, 114(4):470–472.CrossRefGoogle Scholar
  6. Pendse, R. and Demmin, J. (1990). Test structures and finite element models for chip stress and plastic package reliability. In Proc. International Conference on Microelectronic Test Structures, volume 3, pages 155–159.CrossRefGoogle Scholar
  7. Suhir, E. (1998). The future of microelectronics and photonics and the role of mechanics and materials. Trans. ASME Journal of Electronic Packaging, 120(1):1–11.CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media New York 1999

Authors and Affiliations

  • Gerard Kelly
    • 1
  1. 1.National Microelectronics Research CentreUniversity College CorkIreland

Personalised recommendations