The work described in this book helped clarify the nature and importance of encapsulation stress, and how it can be predicted. However there are some issues still remaining which are outside the scope of this book but warrant further investigation.


Electronic Packaging ASME Journal Numerical Analysis Technique Failure Rate Model Wire Sweep 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Springer Science+Business Media New York 1999

Authors and Affiliations

  • Gerard Kelly
    • 1
  1. 1.National Microelectronics Research CentreUniversity College CorkIreland

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