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An Introduction to Plastic Packaging

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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

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Abstract

A plastic package is comprised of at least four different materials, the silicon die, the metal die paddle and leadframe, the die attach material or adhesive used to mechanically attach the die to the die paddle, and the plastic encapsulant. Figure 1.1 illustrates the typical structure of a PQFP (Plastic Quad Flat Pack) package. The die paddle (alloy42 or copper) and leadframe (individual lead fingers) are stamped or etched out of metal strips designed to support multiple die. Figure 1.2 shows such a leadframe strip. The die paddle is essentially a flat metal plate with diagonal ties (known as tie bars) connected to the frame of the metal strip. The function of the tie bar is to support the die and hold it in place during transfer molding.

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Authors and Affiliations

  1. National Microelectronics Research Centre, University College Cork, Ireland

    Dr. Gerard Kelly

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  1. Dr. Gerard Kelly
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© 1999 Springer Science+Business Media New York

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Kelly, G. (1999). An Introduction to Plastic Packaging. In: The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-5011-2_1

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  • DOI: https://doi.org/10.1007/978-1-4615-5011-2_1

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-7276-9

  • Online ISBN: 978-1-4615-5011-2

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