Ultrasonic On-Line Monitoring and Mapping of Low-Temperature Diffusion Bonding of 6061-T6 Aluminum
Diffusion bonding is a process in which both elevated temperature and pressure are applied to the interface between two samples until a permanent bond is established1, 2. Diffusion bonding techniques are frequently used in applications where the high heat input of welding has to be avoided. Since the time required for the formation of a good bond depends on many parameters other than pressure and temperature, such as surface roughness, surface contamination, or the composition of the interlayer3, it is difficult to know the exact time needed to complete the bonding process4. As a result, many trial and error experiments are needed to achieve good bonding parameters. Monitoring of the adhesion process is important in those applications where delicate components are being bonded and minimal heat input and applied pressure are sought.
KeywordsBonding Process Diffusion Bonding High Heat Input Aluminum Specimen Diffusion Bonding Process
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