Solder Paste and Its Application

  • Ray P. Prasad
Chapter

Abstract

In the reflow soldering of surface mount assemblies. solder paste is used for the connection between the leads or terminations of surface mount components and the lands. Solder paste is applied to the surface mount lands by screening, stenciling, or dispensing. Each process has its pros and cons.

Keywords

Nickel Torque Ozone Epoxy Glycol 

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Copyright information

© Springer Science+Business Media Dordrecht 1997

Authors and Affiliations

  • Ray P. Prasad
    • 1
  1. 1.Ray Prasad Consultancy GroupPortlandUSA

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