Solder Paste and Its Application

  • Ray P. Prasad


In the reflow soldering of surface mount assemblies. solder paste is used for the connection between the leads or terminations of surface mount components and the lands. Solder paste is applied to the surface mount lands by screening, stenciling, or dispensing. Each process has its pros and cons.


Solder Joint Solder Ball Screen Printer Ball Grid Array Fine Pitch 
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Copyright information

© Springer Science+Business Media Dordrecht 1997

Authors and Affiliations

  • Ray P. Prasad
    • 1
  1. 1.Ray Prasad Consultancy GroupPortlandUSA

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