Substrates for Surface Mounting

  • Ray P. Prasad


The substrate, also referred to as the packaging and interconnecting structure, plays a crucial role in ensuring the electrical, thermal, and mechanical reliability of electronic assemblies. The term substrate can be defined in two categories: (1) laminate substrate. which is used to make the printed wiring hoard (PWB) or printed circuit board (PCB); (2) constraining substrate. which is used for decreasing the CTF (coefficient of thermal expansion) or increasing the thermal conduction. Unless we are specific, the term substrate could refer to either of these two categories. Before choosing from among the many types of substrate (of either category) that are available for military and commercial applications, however, it is necessary to determine the properties that will be required. Then a substrate material that meets all the requirements in a cost-effective manner can be selected.


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  1. 1.
    Coombs, Clyde F.Printed Circuit HandbookMcGraw Hill, 2nd edition, 1979, pages 2–18, 2–22, 23–5.Google Scholar
  2. 2.
    Lee, L. C., et al. “Micromechanics of multilayer printed circuit board.”IBM Journal of Research and DevelopmentVol. 28, No. 6, November 1984.Google Scholar
  3. 3.
    IPC-SM-782. Surface Mount Land Patterns: Configurations and Design Rules. IPC, Northbrook, IL.Google Scholar
  4. 4.
    Gray, F., Paper WCIV-38 presented at the Printed Circuit World Convention, Tokyo, 1987. Available from IPC, Northbrook, IL.Google Scholar
  5. 5.
    Hughes, E. W., and Beckman, E. C. Porcelain Enameled Metal Substrates for Surface Mount Components. Publication of FerrECA Electronics Company, 3130 West 22nd Street, P.O. Box 8305, Erie, PA 16505.Google Scholar
  6. 6.
    Foster Gray. “Substrates for chip carrier interconnections.” InSurface Mount TechnologyInternational Society for Hybrid Microelectronics Technical Monograph Series 6984–002, 1984, Reston, VA, pp. 57–85.Google Scholar
  7. 7.
    IPC-CF-152. Metallic Foil Specification for Copper-Invar-Copper for Printed Wiring and Other Related Applications. IPC, Northbrook, IL.Google Scholar
  8. 8.
    Hanson, R., and Hauser, J. L. “New board overcomes TCE problem.”EP&PNovember 1986, pp. 48–51.Google Scholar
  9. 9.
    Jensen, W. M. U.S. patent number 4,318,954, March 9, 1982.Google Scholar
  10. 10.
    Chen, C. H., and Verville, J. M. “Direct soldering of ceramic chip carrier solves radio production problems.”ElectronicsFebruary 1984, pp. 15–17.Google Scholar
  11. 11.
    Parker, J. L., Jr. “Shelf life and durability testing of OSP coated printed wiring boards.” Proceedings of Technical Program SMI 95, San Jose, August 29–31, 1995, pp. 907–912.Google Scholar
  12. 12.
    Artaki, I.; Ray, U.; Vianco, P.; Gordon, H. M.; and Jackson, A. M. “Solderability Preservative Coatings: Electroless Tin Vs. Organic Azoles.”Proceedings of Technical Program SMI 93August 29—Sept. 2, 1993, pp. 414–420.Google Scholar
  13. 13.
    Ray, U.; Artaki, I.; Wenger, G. M.; and Machusak, D. A. “Printed wiring board surface finishes: Evaluation of electroless noble metal coatings.”Proceedings of Technical Program SMI 95, San Jose, August 29–31, 1995, pp. 891–906.Google Scholar
  14. 14.
    Davignon, John, and Gray, Foster. “An evaluation of via hole tenting with solder mask designed to pass Mil-P-55110D thermal shock requirements.”Proceedings of Technical Program SMI 91, San Jose, August 25–29, 1991, pp. 905–921.Google Scholar
  15. 15.
    Denkler, J. D. “The speed of liquid.”Circuits ManufacturingMay 1986, pp. 21–24.Google Scholar
  16. 16.
    Manufacturing Technology Review of VHSIC Program by Martin Marietta Corp., August, 1987. Wright Patterson, Air Force Materials Lab, Dayton, OH.Google Scholar
  17. 17.
    IPC-TR-579 Round Robin Evaluation for Small Diameter Plated Through Holes, September 1988. Available from IPC, Northbrook, IL.Google Scholar

Copyright information

© Springer Science+Business Media Dordrecht 1997

Authors and Affiliations

  • Ray P. Prasad
    • 1
  1. 1.Ray Prasad Consultancy GroupPortlandUSA

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