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Solder Paste Technology and Applications

  • Jennie S. Hwang

Abstract

The electronics industry, since the invention of the transistor in 1947, has continued to grow and change through evolutionary and revolutionary developments. Most recently, the strongest trend in the design and manufacture of electronics packages is the application of surface mount technology in lieu of conventional through-hole technology in populating printed circuit boards. As the name implies, surface mount technology involves placing components and devices on the surface of the circuit board, instead of through the board, by using engineering and scientific principles. This concept has been adopted in hybrid assemblies since the 1960s, yet its actual application in printed circuit assemblies was not fully developed until the early 1980s.

Keywords

Shear Rate Solder Joint Storage Modulus Solder Alloy Solubility Parameter 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1991

Authors and Affiliations

  • Jennie S. Hwang

There are no affiliations available

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