Solder Paste Technology and Applications

  • Jennie S. Hwang


The electronics industry, since the invention of the transistor in 1947, has continued to grow and change through evolutionary and revolutionary developments. Most recently, the strongest trend in the design and manufacture of electronics packages is the application of surface mount technology in lieu of conventional through-hole technology in populating printed circuit boards. As the name implies, surface mount technology involves placing components and devices on the surface of the circuit board, instead of through the board, by using engineering and scientific principles. This concept has been adopted in hybrid assemblies since the 1960s, yet its actual application in printed circuit assemblies was not fully developed until the early 1980s.


Shear Rate Solder Joint Storage Modulus Solder Alloy Solubility Parameter 
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  1. 1.
    Hwang, J. S., Solder Paste in Electronics Packaging—Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, Van Nostrand Reinhold, New York, 1989.Google Scholar
  2. 2.
    March, J., Advanced Organic Chemistry, Reactions, Mechanisms, and Structure, McGraw-Hill, New York, 1968.Google Scholar
  3. 3.
    Hwang, J. S., “Solder Paste Rheology—Principle and Practice,” Technical Proceedings, Expo SMT 88, pp. 171–177.Google Scholar
  4. 4.
    Ferry, J. D., Viscoelastic Properties of Polymers, Wiley, New York, 1970.Google Scholar
  5. 5.
    Riemer, D. E., “Analytical Engineering Model of the Screen Printing Process,” Solid State Technology, September 1988, p. 85.Google Scholar
  6. 6.
    Hwang, J. S., “Controlled Atmosphere Soldering—Principle and Practice,” Technical Proceedings, NEPCON-West, 1990.Google Scholar
  7. 7.
    Vandervoort, S., “Lamp IR Reflow Provides Repeatability Between Units,” Electronic Packaging and Production, May 1989, p. 58.Google Scholar
  8. 8.
    Martel, M. L., “New Wrinkles in Reflow,” Circuits Manufacturing, June 1989, p. 33.Google Scholar
  9. 9.
    Dow, S., “Reflow Soldering Survey,” Assembly Engineering, December 1988, p. 18.Google Scholar
  10. 10.
    Glynn, M., “Full Spectrum IR Reflow through Energy Management,” Printed Circuits Assembly, February 1989, p. 22.Google Scholar
  11. 11.
    McGinn, K. S., “Effects of Furnace Atmosphere Chemistry in Sintering,” Industrial Heating, May 1985.Google Scholar
  12. 12.
    Stolarski, R. S., and R. J. Cicerone, Can. J. Chem., 52, 1974, p. 161.CrossRefGoogle Scholar
  13. 13.
    Bonner, J. K., “Searching for a Substitute,” Circuits Manufacturing, July 1989, p. 42.Google Scholar
  14. 14.
    Hwang, J. S., “Soldering and Solder Paste Prospects,” Surface Mount Technology, October 1989, p. 56.CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media New York 1991

Authors and Affiliations

  • Jennie S. Hwang

There are no affiliations available

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