Solder Paste Technology and Applications
The electronics industry, since the invention of the transistor in 1947, has continued to grow and change through evolutionary and revolutionary developments. Most recently, the strongest trend in the design and manufacture of electronics packages is the application of surface mount technology in lieu of conventional through-hole technology in populating printed circuit boards. As the name implies, surface mount technology involves placing components and devices on the surface of the circuit board, instead of through the board, by using engineering and scientific principles. This concept has been adopted in hybrid assemblies since the 1960s, yet its actual application in printed circuit assemblies was not fully developed until the early 1980s.
KeywordsFurnace Convection Cadmium Chlorine Carbon Monoxide
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- 1.Hwang, J. S., Solder Paste in Electronics Packaging—Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, Van Nostrand Reinhold, New York, 1989.Google Scholar
- 2.March, J., Advanced Organic Chemistry, Reactions, Mechanisms, and Structure, McGraw-Hill, New York, 1968.Google Scholar
- 3.Hwang, J. S., “Solder Paste Rheology—Principle and Practice,” Technical Proceedings, Expo SMT 88, pp. 171–177.Google Scholar
- 4.Ferry, J. D., Viscoelastic Properties of Polymers, Wiley, New York, 1970.Google Scholar
- 5.Riemer, D. E., “Analytical Engineering Model of the Screen Printing Process,” Solid State Technology, September 1988, p. 85.Google Scholar
- 6.Hwang, J. S., “Controlled Atmosphere Soldering—Principle and Practice,” Technical Proceedings, NEPCON-West, 1990.Google Scholar
- 7.Vandervoort, S., “Lamp IR Reflow Provides Repeatability Between Units,” Electronic Packaging and Production, May 1989, p. 58.Google Scholar
- 8.Martel, M. L., “New Wrinkles in Reflow,” Circuits Manufacturing, June 1989, p. 33.Google Scholar
- 9.Dow, S., “Reflow Soldering Survey,” Assembly Engineering, December 1988, p. 18.Google Scholar
- 10.Glynn, M., “Full Spectrum IR Reflow through Energy Management,” Printed Circuits Assembly, February 1989, p. 22.Google Scholar
- 11.McGinn, K. S., “Effects of Furnace Atmosphere Chemistry in Sintering,” Industrial Heating, May 1985.Google Scholar
- 13.Bonner, J. K., “Searching for a Substitute,” Circuits Manufacturing, July 1989, p. 42.Google Scholar