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A Damage Integral Methodology for Thermal and Mechanical Fatigue of Solder Joints

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Solder Joint Reliability

Abstract

The differential thermal expansion of the connected members of a soldered assembly during temperature cycles produces mechanical displacements in solder joints. The resulting cyclic stresses are the driving force for damage processes that eventually cause fatigue failures. Conventional approaches to solder joint fatigue rely on correlations between fatigue life of the solder joint and some measurable or calculable parameter characteristic of the fatigue loading. These approaches often require extensive fatigue data to establish such correlations. Furthermore, their validity is often limited to the range over which the parameters in the correlation are uniquely related to the stress in the solder joint. The plastic strain range is an example of such a parameter. For a given plastic strain range, the stress in the solder joint may vary, however, depending on the displacement rate, such that the correlation between the plastic strain range and the number of cycles to failure is not unique.

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Authors
  1. Che-Yu Li
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  2. R. Subrahmanyan
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  3. J. R. Wilcox
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  4. D. Stone
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Editor information

John H. Lau

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© 1991 Springer Science+Business Media New York

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Li, CY., Subrahmanyan, R., Wilcox, J.R., Stone, D. (1991). A Damage Integral Methodology for Thermal and Mechanical Fatigue of Solder Joints. In: Lau, J.H. (eds) Solder Joint Reliability. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3910-0_12

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  • DOI: https://doi.org/10.1007/978-1-4615-3910-0_12

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-6743-7

  • Online ISBN: 978-1-4615-3910-0

  • eBook Packages: Springer Book Archive

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