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Creep and Stress Relaxation in Solder Joints

  • Peter M. Hall

Abstract

Stress-strain analysis of solder joints is a wonderful field. Stress and strain both have six components, and there are thirty-six elastic “constants” (which of course are not constant at all). All these depend on the position in the joint, the composition, purity, history, temperature, and geometrical configuration of the solder, as well as the surrounding structure and its properties and temperature distribution. In addition, they are functions of time, with time “constants” ranging from milliseconds to centuries. All together, there are enough variables to keep the journals supplied with papers for years to come. (A bibliography compiled a few years ago’ already contained some 372 references.) This provides opportunities for us to exercise our skills in materials science, mechanical engineering, physics, chemistry, and metallurgy. The game of course, is to focus on one or two independent variables and one or two dependent variables and study their interaction. The hope is that the others can be kept more or less under control or that they don’t matter too much, and if we don’t oversimplify something important, perhaps some insights can be gained. The problem is that the reliability of these joints is a deadly serious matter. They are created by the billions, and all kinds of important (and unimportant) devices rely on their performance.

Keywords

Shear Strain Solder Joint Stress Relaxation Strain Range Temperature Cycling 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1991

Authors and Affiliations

  • Peter M. Hall

There are no affiliations available

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