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X-Ray Tomographic Techniques for Inspection of Electronic Components

  • R. J. Kruse
  • R. H. Bossi
Chapter

Abstract

X-ray tomographic techniques including computed tomography (CT) and laminography (body scan tomography) have been examined for their potential for meeting the manufacturing inspection requirements of electronic components and printed wiring assemblies [1,2]. Comparisons with radioscopic inspections have been made.

Keywords

Solder Joint Solder Ball Test Board Manual Interpretation Surface Mount Technology 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    R. H. Bossi, R. J. Kruse and B. W. Knutson, “Computed Tomography of Electronics”, WRDC-TR-89-4112, December 1989.Google Scholar
  2. 2.
    R. H. Bossi and R. J. Kruse, “X-Ray Tomographic Inspection of Printed Wiring Assemblies and Electrical Components”, WRDC-TR-90-4091, October 1990.Google Scholar
  3. 3.
    C. McBee, “Scanned Beam Laminography”, Circuits Manufacturing, January 1989, pp.67-69.Google Scholar
  4. 4.
    B. Baker, “X-Ray Inspection of Three-Dimensional Solder Joints”, Electronic Manufacturing, February 1989, pp. 20-22.Google Scholar
  5. 5.
    D. Byrne, “Taguchi Methods”, Chapter 2, Taguchi and OFD: Hows and Whys for Management, N. Ryan, ed., ASI Press, Dearborn, MI, 1988.Google Scholar
  6. 6.
    S. Buchele, H. Ellinger, F. Hopkins, “Forming Laminograms on Object-Dependent Surfaces,” Materials Evaluation, May 1990, pp. 618-620.Google Scholar

Copyright information

© Plenum Press, New York 1991

Authors and Affiliations

  • R. J. Kruse
    • 1
  • R. H. Bossi
    • 1
  1. 1.Physics DepartmentBoeing Aerospace and ElectronicsSeattleUSA

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