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Characterization of Glued Bonds Using Ultrasonic Reflected Beam

  • A. Jungman
  • Ph. Guy
  • A. Nayfeh
  • G. Quentin
  • J. C. Le Flour
Chapter

Abstract

Adhesive bonds of laminates of metal and polymer have been extensively studied using ultrasonic techniques. The strength of the bond is of primary importance and many studies have been aimed at deducing this property from ultrasonic measurements. The quality of adhesively joined structures is mainly determined by two types of factors: i) the cohesive strength of the glue ii) the adhesive strength of the metal-glue interface. To address the last type, several ultrasonic techniques using mainly plate and interface waves have been recently considered [1–4]. Their main advantage, compared to longitudinal or shear waves, is that they are very sensitive to the interface conditions.

Keywords

Reflection Coefficient Steel Plate Adhesive Layer Ultrasonic Technique Slip Interface 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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    Y. Bar-Cohen and A.K. Mal, Characterization of Adhesive Bonding Using Leaky Lamb Waves. Review of Progress in Quantitative N.D.E., Edited by D.O. Thompson and D.E. Chimenti (Plenum Press, New York 1990), Vol 9B, p 1271.Google Scholar
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Copyright information

© Plenum Press, New York 1991

Authors and Affiliations

  • A. Jungman
    • 1
  • Ph. Guy
    • 1
  • A. Nayfeh
    • 1
    • 3
  • G. Quentin
    • 1
  • J. C. Le Flour
    • 2
  1. 1.Groupe de Physique des SolidesUniversite Paris 7Paris cedex 05France
  2. 2.Régie Nationale des Usines RenaultBoulogne Billancourt CedexFrance
  3. 3.Department of Aerospace Engineering and Engineering MechanicsUniversity of CincinnatiCincinnatiUSA

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