Thermal Management

  • Gerald L. Ginsberg
Chapter

Abstract

The thermal management of electronic equipment encompasses all of the natural and artificial processes and technologies that can be used to remove and transport heat from individual components in a controlled manner to the ultimate system heat sink, Figure 9.1. In general, it is not usually too difficult to package the equipment in such a manner that it can operate properly at a nominal end-use thermal enviroment. The challenge arises in attempting to provide the electronics with stability in an environment with variations in storage and operating temperature, not to mention the effects on the environment of other heat-generating (or airflow blocking) units in or around the electronics being packaged [1, 2].

Keywords

Dust Convection Foam Mold Epoxy 

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Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Gerald L. Ginsberg

There are no affiliations available

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