Thermal Management

  • Gerald L. Ginsberg


The thermal management of electronic equipment encompasses all of the natural and artificial processes and technologies that can be used to remove and transport heat from individual components in a controlled manner to the ultimate system heat sink, Figure 9.1. In general, it is not usually too difficult to package the equipment in such a manner that it can operate properly at a nominal end-use thermal enviroment. The challenge arises in attempting to provide the electronics with stability in an environment with variations in storage and operating temperature, not to mention the effects on the environment of other heat-generating (or airflow blocking) units in or around the electronics being packaged [1, 2].


Heat Transfer Natural Convection Heat Sink Heat Pipe Electronic Equipment 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. 1.
    R. C. Chu, R. E. Simmons, IBM Corporation, “Thermal Management of Large Scale Digital Computers,” International Journal for Hybrid Microelectronics,Volume 7, Number 3, September 1984, pp. 35–43.Google Scholar
  2. 2.
    Michael W. Gust, The Mitre Corporation, “Thermal Considerations in System Design,” Proceedings International Electronic Packaging Society Conference, 1987, pp. 10–25.Google Scholar
  3. 3.
    International Electronic Research Corporation, “Heat Sink/Dissipator Products and Thermal Management Guide.”Google Scholar
  4. 4.
    Kinishi Itoh, “Heat Management Faces Demand of High Thermal Density,” Electronic Packaging & Production,January 1987, pp. 136–139.Google Scholar
  5. 5.
    S. Witzman, K. Graham, Bell-Northern Research and Northern Telecom Electronics Ltd., “Design Considerations for Cooling in Telecommunications Equipment,” Proceedings International Electronic Packaging Society Conference,1987, pp. 1036–1047.Google Scholar
  6. 6.
    Gordon N. Ellison, Tektronix Inc., “The PCB Thermal Analysis Problem,” Printed Circuit Design,October 1987, pp. 27–30.Google Scholar
  7. 7.
    E. A. Wilson, Honeywell Bull Inc., “Thermal Management Design for a Large Mainframe,” Electronic Packaging & Production,February 1989, pp. 142–144.Google Scholar
  8. 8.
    Jack Spoor, Aham Tor Inc., “Heat Sink Application Handbook,” 1974, pp. 1–35.Google Scholar
  9. 9.
    Joel Newberger, Aham Tor Inc., “Thermal System Approach to Heat Sink Selection,” 1979.Google Scholar
  10. 10.
    Carlos C. Chardon, Torin Corp., “Design Equipment to Run Silent, Run Cool,” Reprinted with permission from Electronic Design,(vol. 30, No. 6), June 21, 1980, pp. 119–125.Google Scholar
  11. 11.
    Rotron Inc., “Selecting/Specifying Fans and Blowers,” ENG O10A, March 1978.Google Scholar
  12. 12.
    Howard W. Markstein, “Liquid Cooling Optimizes Heat Transfer,” Electronic Packaging & Production,April 1988, pp. 46–49.Google Scholar
  13. 13.
    Tom Dewey, “Developments in Liquid Immersion Cooling,” Electronic Packaging & Production,April 1988, pp. 59–61.Google Scholar
  14. 14.
    M Industrial Chemical Products Division, “FluorinertT” Liquid Heat Sink Technical Description and Application Data,“ 98–0211–6032–4, February 1989.Google Scholar
  15. 15.
    A. Basiulius, C. P. Minning, Hughes Aircraft Co., “Improving Circuit Reliability with Heat Pipes,” Electronic Packaging & Production,September 1986, pp. 104–105.Google Scholar
  16. 16.
    Milton Levine, Melcor/Materials Electronic Products Inc., “Solid State Cooling with Thermoelectrics,” Electronic Packaging & Production,November 1989, pp. 74–77.Google Scholar

Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Gerald L. Ginsberg

There are no affiliations available

Personalised recommendations