Abstract
This chapter covers the reflow methods currently available for reflowing solder paste. Literally, reflow is a misnomer; in the context of solder paste technology it means to flow or melt the paste, rather than tore-flow. Since it has been an accepted term in the solder paste field, “reflow” will be used in this text. The reflow methods discussed here do not deal with wave soldering or other soldering techniques unrelated to the paste form.
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsPreview
Unable to display preview. Download preview PDF.
References
Ahmet N. Arslancan. Radiant Technology Corporation, Cerritas, California.
Equipment Literature. Vitronics Corporation, Newburyport, Massachusetts.
Excel Company, Ltd., Index Corporation, San Jose, California.
Ahmet N. Arslancan and David K. Flattery, “Infrared Reflow for SMT: Thermal and Yield Considerations,” proceedings, 1987 National Electronic Packaging and Production Convention-West: 357.
R. G. Spiecker and D. Haggis, “Soldering Techniques for Surface Mounted Leadless Chip Carriers,” 1986 proceedings, International Symposium on Hybrid Microelectronics, 902.
A. V. Sedrick, “How to Solder Two Sides in One Pass,” Circuits Manufacturing (Nov. 1986).
James E. Smorto, “Computer Controlled Infrared Solder Reflow: One Manufacturer’s Approach,” SITE (Apr. 1987).
David K. Flattery, “Infrared Reflow for Solder Attachment of Surface Mounted Devices,” Connection Technology (Feb. 1987).
Norman R. Cox, “Infrared Solder Reflow of Surface Mounted Devices,” Hybrid Circuit Technology (Mar. 1985).
J. Holloman and D. Rall, “Advances in Reflow Soldering Process Control,” proceedings, 1987 National Electronic and Production Convention-West: 393.
“Fluorinert Liquids,” product bulletin, 3M/Industrial Chemical Products Division.
“Multifluor Inert Fluids,” product bulletin, Air Products and Chemicals, Incorporated.
Product bulletin, HTC, Concord, Massachusetts.
Michael J. Rickriegel, “The Benefits of Dual Vapor Inline Vapor Phase Soldering” (Corpane Industries, Incorporated).
Product data sheet, Hollis Automation, Nashua, New Hampshire.
“Catalog 501,” Hughes Aircraft Company, Carlsbad, California.
E. Lish, “Applications of Laser Microsoldering to SMDs”, proceedings, 1985 International Hybrid Microelectronics Symposium: 1.
F. Burns and C. Zyetz. Electronic Packaging and Production (May 1981).
Edgar A. Wright, “Laser Versus Vapor Phase Soldering,” Society for the Advancement of Material and Processing Engineering (1985).
Carl B. Miller, “Lasers in 1-Iybrid Circuit Manufacturing,” Hybrid Circuit Technology (Jul. 1984).
Private communication: E. F. Lish. Martin Marietta Corporation.
Private communication: Riccardo Vanzetti. Vanzetti Systems, Incorporated, Stoughton, Massachusetts.
Norman R. Cox, “Lamp 1R Soldering,” Circuits Manufacturing (May 1988).
I. Anjoh et. al., “Analysis of the Package Cracking Problem With Vapor Phase Reflow Soldering and Corrective Actions,” Brazing and Soldering 14 (Spring 1988).
Hiroshi Miura, “Overview of YAG Laser Soldering Systems,” Electronic Manufacturing (Feb. 1988).
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 1992 Springer Science+Business Media New York
About this chapter
Cite this chapter
Hwang, J.S. (1992). Soldering Methodologies. In: Solder Paste in Electronics Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3528-7_7
Download citation
DOI: https://doi.org/10.1007/978-1-4615-3528-7_7
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-442-01353-0
Online ISBN: 978-1-4615-3528-7
eBook Packages: Springer Book Archive