Abstract
Solder paste is simple and plain in appearance, yet its fundamentals are broad and complex. It can be well understood only with an interdisciplinary approach.
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© 1992 Springer Science+Business Media New York
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Hwang, J.S. (1992). Interdisciplinary Approach. In: Solder Paste in Electronics Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3528-7_2
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DOI: https://doi.org/10.1007/978-1-4615-3528-7_2
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-442-01353-0
Online ISBN: 978-1-4615-3528-7
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