Non-Destructive Evaluation of Adhesion at Metal-Insulator Interfaces Based on Extremely-Low-Frequency Dielectric Spectroscopy

  • Dario Narducci
  • Jerome J. Cuomo
  • David L. Pappas
  • Krishna Sachdev


We present an application of Extremely-Low-Frequency Dielectric Spectroscopy as a non-destructive method to analyze corrosion-induced adhesion failure at metalpolymer interfaces. The Cu-Cr adhesion to polyimides (PI’s) is evaluated. Measurements are carried out in the frequency range 1 - 105 Hz as a function of temperature (308 - 623 K), moisture content (0 - 80 %) and time (up to 3 days). The dielectric response is shown to be determined by water diffusion into the PI under the metallization. A correlation between dielectric properties and the mechanical failure of the metallization is found, which is discussed in relation to potential applications in quality control.


Metal Strip Peel Test Peel Strength Adhesion Failure Relative Humidity Level 
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Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Dario Narducci
    • 1
  • Jerome J. Cuomo
    • 3
  • David L. Pappas
    • 3
  • Krishna Sachdev
    • 2
  1. 1.Dipartimento di Chimica Fisica ed ElettrochimicaMilanoItaly
  2. 2.IBM-GTDHopewell JunctionUSA
  3. 3.T.J. Watson Research CenterIBM Research DivisionYorktown HeightsUSA

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