Non-Destructive Evaluation of Adhesion at Metal-Insulator Interfaces Based on Extremely-Low-Frequency Dielectric Spectroscopy

  • Dario Narducci
  • Jerome J. Cuomo
  • David L. Pappas
  • Krishna Sachdev

Abstract

We present an application of Extremely-Low-Frequency Dielectric Spectroscopy as a non-destructive method to analyze corrosion-induced adhesion failure at metalpolymer interfaces. The Cu-Cr adhesion to polyimides (PI’s) is evaluated. Measurements are carried out in the frequency range 1 - 105 Hz as a function of temperature (308 - 623 K), moisture content (0 - 80 %) and time (up to 3 days). The dielectric response is shown to be determined by water diffusion into the PI under the metallization. A correlation between dielectric properties and the mechanical failure of the metallization is found, which is discussed in relation to potential applications in quality control.

Keywords

Porosity Hydrolysis Quartz Graphite Silane 

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Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Dario Narducci
    • 1
  • Jerome J. Cuomo
    • 3
  • David L. Pappas
    • 3
  • Krishna Sachdev
    • 2
  1. 1.Dipartimento di Chimica Fisica ed ElettrochimicaMilanoItaly
  2. 2.IBM-GTDHopewell JunctionUSA
  3. 3.T.J. Watson Research CenterIBM Research DivisionYorktown HeightsUSA

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