The Application of a Polypyrrole Precoat for the Metallization of Printed Circuit Boards

  • Shimshon Gottesfeld
  • Francisco A. Uribe
  • Steven P. Armes


We describe a printed circuit (PC) board metallization process starting with the formation of a precoat of polypyrrole (PPY) on the board followed by the direct electrodeposition of copper onto the polypyrrole-coated substrate. The polypyrrole film is applied to the insulating substrate by a single chemical polymerization step from an aqueous solution. The sheet resistivity of the polypyrrole precoat is typically of the order of a few hundred ohms/square, but this turns out to be a sufficiently low resistance to enable direct metal electrodeposition onto the PPY-coated substrate.


Print Circuit Board Copper Deposit Peel Strength Sheet Resistivity Electroless Copper 
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Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Shimshon Gottesfeld
    • 1
  • Francisco A. Uribe
    • 1
  • Steven P. Armes
    • 1
  1. 1.Electronics Research GroupLos Alamos National LaboratoryLos AlamosUSA

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