The Application of a Polypyrrole Precoat for the Metallization of Printed Circuit Boards
We describe a printed circuit (PC) board metallization process starting with the formation of a precoat of polypyrrole (PPY) on the board followed by the direct electrodeposition of copper onto the polypyrrole-coated substrate. The polypyrrole film is applied to the insulating substrate by a single chemical polymerization step from an aqueous solution. The sheet resistivity of the polypyrrole precoat is typically of the order of a few hundred ohms/square, but this turns out to be a sufficiently low resistance to enable direct metal electrodeposition onto the PPY-coated substrate.
KeywordsPrint Circuit Board Copper Deposit Peel Strength Sheet Resistivity Electroless Copper
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