Abstract
One important field of application for acoustic microscopy is the characterization of layers in semiconductor technology. Thickness measurement is possible from opaque layers in a nondestructive way without the need of edges. The measurements require a pad of 40.40 µm2. This leads to a spatial resolution of the same magnitude. In search for further applications it seemed to be of big interest for technology to try the expansion of this method on buried layers.
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© 1992 Springer Science+Business Media New York
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Krause, J., Schwierzi, B. (1992). Thickness Measurement of Passivated Metallization Layers by Saw Dispersion. In: Ermert, H., Harjes, HP. (eds) Acoustical Imaging. Acoustical Imaging, vol 19. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3370-2_99
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DOI: https://doi.org/10.1007/978-1-4615-3370-2_99
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4613-6487-0
Online ISBN: 978-1-4615-3370-2
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