Abstract
Multichip packaging is receiving increased attention as electronic equipment manufacturers drive toward smaller, faster and less expensive products. By connecting several chips together in a single package:
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Board size can be reduced by up to a factor of 10 or more
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Signal propagation between chips can be up to three times faster
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The number of solder connections in a system can be reduced
Even so, multichip modules (MCMs) will be utilized only where they are the least expensive method of meeting system requirements. The choice of MCM materials and manufacturing processes greatly influences the cost of a multichip module technology in terms of piece part cost, manufacturing yield, manufacturing cycle time and repairability. Materials choices are also dominant factors in the electrical and thermal performance of a module. There is no single “right” choice; rather, different choices are appropriate for different applications.
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Dixon, A.C., Myszka, E.G. (1993). MCM Package Selection: A Materials and Manufacturing Perspective. In: Doane, D.A., Franzon, P.D. (eds) Multichip Module Technologies and Alternatives: The Basics. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3100-5_2
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DOI: https://doi.org/10.1007/978-1-4615-3100-5_2
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