The Development of Unisys Multichip Modules

  • John A. Nelson
  • Randy D. Rhodes


Do mainframe computers really need multichip modules (MCMs)? Won’t advancements in silicon technology alone be sufficient for next generation computers? What are the challenges in designing MCMs? Can we design future computers with current packaging technology? These are some of the questions this chapter will answer.


Solder Joint Laser Welding Solder Bump Single Chip Junction Temperature 
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Copyright information

© Springer Science+Business Media New York 1993

Authors and Affiliations

  • John A. Nelson
  • Randy D. Rhodes

There are no affiliations available

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