Advertisement

The Development of Unisys Multichip Modules

  • John A. Nelson
  • Randy D. Rhodes
Chapter

Abstract

Do mainframe computers really need multichip modules (MCMs)? Won’t advancements in silicon technology alone be sufficient for next generation computers? What are the challenges in designing MCMs? Can we design future computers with current packaging technology? These are some of the questions this chapter will answer.

Keywords

Solder Joint Laser Welding Solder Bump Single Chip Junction Temperature 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    A. S. Rappaport and S. Halevi, “The Computerless Computer Company,” Harvard Business Review, vol. 52, pp. 69–80, July/Aug. 1991.Google Scholar
  2. 2.
    “Should the U.S. Abandon Computer Manufacturing,” Harvard Business Review, vol. 52, pp. 140–160, Sept./Oct. 1991.Google Scholar
  3. 3.
    E. Davidson, “The Coming of Age For MCM Packaging Technology,” IEEE Computer Packaging Workshop, (Lake Tahoe, CA), May 1991. No published proceedings.Google Scholar
  4. 4.
    H. W. Markstein, ed., “Multichip Modules Pursue Wafer Scale Performance,” Electronic Packaging & Production, vol. 31, pp. 40–44, Oct. 1991.Google Scholar
  5. 5.
    A. J. Blodgett and D. R. Barbour, “Thermal Conduction Module: A High Performance Multilayer Ceramic Package,” IBM J. Res. and Devel., vol. 26, pp. 3036, 1982.Google Scholar
  6. 6.
    J. U. Knickerbocker, et al., “IBM System/390 Air-Cooled Alumina Thermal Conduction Module,” IBM J. Res. and Devel., vol. 35, pp. 330–348, May 1991.CrossRefGoogle Scholar
  7. 7.
    V. L. Gani, et al., “IBM Enterprise System/9000 Type 9121 Model 320 Air Cooled Processor Technology,” IBM J. Res. and Devel., vol. 35, pp. 342–351, May 1991.CrossRefGoogle Scholar
  8. 8.
    B. Blood, “ASIC Design Methodology For Multichip Modules,” Hybrid Circuit Technology, vol. 8, pp. 21–27, Dec. 1991.Google Scholar
  9. 9.
    J. Nelson and C. Cheves, “Multichip Module For A Cost Driven Mainframe,” Proc. Internat. Electronic Packaging Soc. Conf., IEPS, (San Diego CA), pp. 230–240, Sept. 1989.Google Scholar
  10. 10.
    R. D. Rhodes, “Multichip Packages at Unisys - Cofired Ceramic to Thin Film,” NEPCON Proceedings, (Anaheim CA), vol. 1, pp. 477–485, Feb. 1991.Google Scholar
  11. 11.
    “Emerging Technologies, What The Experts Say,” Inside ISHM, vol. 18, pp. 5–12, Nov./Dec. 1991.Google Scholar
  12. 12.
    J. D. Mosley, ed.,“Multichip Modules, Lack of Standards Impedes Design Issues,” EDN, vol. 21, pp. 35–42, Jan. 1992.Google Scholar
  13. 13.
    K. O’Brien and T. Williams, eds., “A Changing Hybrid Marketplace,” Hybrid Circuit Technology, vol. 8, pp. 14–18, Dec. 1991.Google Scholar
  14. 14.
    “The MCM Market: It’s Anybody’s Guess,” Hybrid Circuit Technology, vol. 9, pp. 6–7, Jan. 1992.Google Scholar

Copyright information

© Springer Science+Business Media New York 1993

Authors and Affiliations

  • John A. Nelson
  • Randy D. Rhodes

There are no affiliations available

Personalised recommendations