Abstract
Electrical testing is used throughout the multichip module fabrication process to verify the quality of each processing step and component which goes into the module. Once module assembly is complete, a final test is performed to make sure that the module functions to its specifications. It is desirable to locate any faults as early in the manufacturing process as possible since this results in a lower overall cost. Testing can be divided into three basic areas: substrate test, integrated circuit (IC) test and module test. Substrates are tested during fabrication and prior to component attach. ICs and other components are tested prior to mounting on the substrate. The assembled module is tested prior to final sealing to permit repair of faulty components.
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Russell, T.C., Wen, Y. (1993). Electrical Testing of Multichip Modules. In: Doane, D.A., Franzon, P.D. (eds) Multichip Module Technologies and Alternatives: The Basics. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3100-5_13
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DOI: https://doi.org/10.1007/978-1-4615-3100-5_13
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