Ultrasonic NDE of Adhesive Metal to Metal Bond Integrity Based on a Combined Numerical and Expert System Approach

  • Reinhold Ludwig
  • John M. SullivanJr.
  • Dacheng Dai


Bonded structures have become increasingly prevalent in the safe and reliable operation of many advanced material components. Concomitant with the wide-spread use of adhesively bonded materials comes the need of nondestructive inspection of the bond line. Since conventional NDE methods offer only partial success in detecting the various possible bondline conditions [1], additional research in the actual energy/bondline interaction is required.


Weak Bond Bond Line Bondline Thickness Numerical Analysis Technique IEEE Ultrasonics Symposium 
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  1. 1.
    G. M. Light and Hegeon Kwun, Nondestructive Evaluation of Adhesive Bond Quality, Southwest Research Institute, Technical Report, SwRI Project 17-7958, San Antonio, Texas, June 1989.Google Scholar
  2. 2.
    J. M. Sullivan, Jr. and Reinhold Ludwig, “Numerical Comparison of Experimentally Measured Ultrasound Through a Multilayered Specimen”, Review of Progress in Quantität NDE,Vol. 10B, pp. 1359–1366, July 1991.Google Scholar
  3. 3.
    J. M. Sullivan, Jr., R. Ludwig and Y, Gang, “Numerical Simulation of Ultrasound NDE for Adhesive Bond Integrity,” IEEE Ultrasonics Symposium, pp. 1095–1098, 1991.Google Scholar
  4. 4.
    J. M. Sullivan, Jr., Reinhold Ludwig, and William J. Grimes, “An Efficient FEM Approach the Study of Ultrasonic Wave Propagation in Solids”, Review of Progress in Quantität NDE, this proceedings.Google Scholar

Copyright information

© Plenum Press, New York 1993

Authors and Affiliations

  • Reinhold Ludwig
    • 1
  • John M. SullivanJr.
    • 2
  • Dacheng Dai
    • 1
  1. 1.Department of Electrical and Computer EngineeringWorcester Polytechnic InstituteWorcesterUSA
  2. 2.Department of Mechanical EngineeringWorcester Polytechnic InstituteWorcesterUSA

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