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Measurement of Residual Stresses on Ceramic Materials with High Spatial Resolution

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Nondestructive Characterization of Materials VI

Abstract

Ceramic materials are often used in high performance semiconductor devices. Brazing is used as a common technique of joining the metal pins with the ceramic chip carriers. Brazing of thermally dissimilar materials results in high stress/strain gradients in the ceramic material which ultimately leads to the inferior performance of the device. Steep stress gradients and constantly decreasing size of the chips dictate the necessity of measuring the stresses with the spatial resolution of 100 μm or higher. The standard large area diffraction is not suitable for this purpose. The present research is concerned with the residual stress measurement in brazed kovar-alumina joints using x-ray micro-diffraction technique.

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References

  1. SAE. “Residual Stress Measurement by X-Ray Diffraction, SAE J784a,” SAE Inc., Warrendale, PA (1971).

    Google Scholar 

  2. I.C. Noyan and J.B. Cohen, “Residual Stress Measurement by Diffraction and Interpretation,” Springer-Verlag, New York (1987).

    Google Scholar 

  3. C.O. Ruud, “Position Sensitive Detector Improves X-Ray Powder Diffraction,” Industrial Research and Development: 84 (January 1983).

    Google Scholar 

  4. J.B. Wachtman, Jr., W.E. Teft, D.G. Lam, Jr., and R.P. Stinchfield, “Elastic Constants of Synthetic Single Crystal Corrundum at Room Temperature,” J. Research Natl. Bur. Standards 64A (3):213 (1960).

    Article  CAS  Google Scholar 

  5. W. Voigt, Lehrbuch der Kristallphysik, Taubner, Leipzig/Berlin (1928).

    Google Scholar 

  6. A. Reuss, Z. Angew Math. Mech. 9:49 (1929).

    Article  CAS  Google Scholar 

  7. Z. Hashin and S. Shtrikman, “A Variational Approach to the Theory of the Elastic Behavior of Polycrystals,” J. Mech. Phys. Solids 10:343 (1962).

    Article  CAS  Google Scholar 

  8. F.P. Knudsen, “Effect of Porosity on Young’s Modulus of Alumina,” J. Amer. Cer. Soc. 45(2):94 (1962).

    Article  CAS  Google Scholar 

  9. R.W. Rice, “Extension of the Exponential Porosity Dependence of Strength and Elastic Moduli,” J. Amer. Cer. Soc. 59(11–12):536 (1976).

    Article  Google Scholar 

  10. R.W. Rice, “Comparison of Stress Concentration Versus Minimum Solid Area Based Mechanical Property-Porosity Relations,” J. Mat. Science 28(8):2187 (1993).

    Article  CAS  Google Scholar 

  11. B.D. Cullity, Elements of X-Ray Diffraction, Addison-Wesley, Reading (1978).

    Google Scholar 

  12. L.D. Dikusar, E.F. Dudarev, and V.E. Panin, “Statistical Theory of the Microdeformations of Polycrystals. I.”, Izv. Vyssh. Zaved., Fizika 8:96 (August 1971).

    Google Scholar 

  13. K.J. Kozaczek, et al., “Microstructural Modeling of Grain Boundary Stresses in Alloy 600,” submitted to J. Mat.Sci.

    Google Scholar 

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© 1994 Springer Science+Business Media New York

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Kozaczek, K.J., Ruud, C.O., Fitting, J.D. (1994). Measurement of Residual Stresses on Ceramic Materials with High Spatial Resolution. In: Green, R.E., Kozaczek, K.J., Ruud, C.O. (eds) Nondestructive Characterization of Materials VI. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-2574-5_36

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  • DOI: https://doi.org/10.1007/978-1-4615-2574-5_36

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-6100-8

  • Online ISBN: 978-1-4615-2574-5

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