Abstract
Ceramic materials are often used in high performance semiconductor devices. Brazing is used as a common technique of joining the metal pins with the ceramic chip carriers. Brazing of thermally dissimilar materials results in high stress/strain gradients in the ceramic material which ultimately leads to the inferior performance of the device. Steep stress gradients and constantly decreasing size of the chips dictate the necessity of measuring the stresses with the spatial resolution of 100 μm or higher. The standard large area diffraction is not suitable for this purpose. The present research is concerned with the residual stress measurement in brazed kovar-alumina joints using x-ray micro-diffraction technique.
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© 1994 Springer Science+Business Media New York
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Kozaczek, K.J., Ruud, C.O., Fitting, J.D. (1994). Measurement of Residual Stresses on Ceramic Materials with High Spatial Resolution. In: Green, R.E., Kozaczek, K.J., Ruud, C.O. (eds) Nondestructive Characterization of Materials VI. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-2574-5_36
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DOI: https://doi.org/10.1007/978-1-4615-2574-5_36
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