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Applications in Ceramic Structures

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Probabilistic Structural Mechanics Handbook

Abstract

The interest in ceramic materials for construction of engineering components has grown considerably during the last decade. This is not surprising because ceramics offer excellent physical properties that are necessary to meet the demands of many high-technology applications. Examples of such properties are high-temperature endurance, extreme wear resistance, nontoxicity, and biocompatibility. On the other hand, the brittleness and low fracture resistance of ceramic materials can be major shortcomings. Unlike metals, ceramics do not yield plastically under sudden load and impact, and they are usually highly susceptible to scratches and flaws arising during production or use. Consequently, special attention must be paid by the design engineer to avoid high peak tensile stresses and to use only specimens that are absolutely flawless, at least when viewed macroscopically. Moreover, because of microscopic flaw size variations the strength within a batch of ceramic specimens can vary considerably. Another problem is that the performance behavior of ceramics is time dependent. A ceramic part can fail over time as a result of stress—corrosion cracking (i.e., the subcritical growth of microscopic cracks inside the stressed ceramic material resulting from water vapor or other environmental influences) even if the tensile stresses are below the critical level.

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Authors
  1. W. H. Müller
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  2. R. Ramme
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  3. A. C. Bornhauser
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Editor information

Editors and Affiliations

  1. Houston, Texas, USA

    C. Sundararajan Ph.D. (Consultant) (Consultant)

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© 1995 Springer Science+Business Media Dordrecht

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Müller, W.H., Ramme, R., Bornhauser, A.C. (1995). Applications in Ceramic Structures. In: Sundararajan, C. (eds) Probabilistic Structural Mechanics Handbook. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-1771-9_30

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  • DOI: https://doi.org/10.1007/978-1-4615-1771-9_30

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-5713-1

  • Online ISBN: 978-1-4615-1771-9

  • eBook Packages: Springer Book Archive

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