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Area Array Interconnection Handbook pp 268–314Cite as

Laminate/HDI Die Carriers

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Abstract

The use of more complex components with very high I/O counts has pushed the board fabricator to re-examine techniques for creating smaller vias. Over the last several years, many new or redeveloped processes have appeared on the market. These processes include revised methods of creating holes, such as laser drilling, micro-punching, and mass etching; new methods for additively creating dielectric with via holes using photo-sensitive dielectric materials; and new methods for metallizing the vias such as conductive adhesives and solid post vias. All of these methods share some common traits. They all allow the designer to significantly increase routing density through the use of vias in SMT pads, to reduce size and weight of product, and to improve the electrical performance of the system. These types of boards are generically called, “High Density Interconnects” or HDI.

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Authors and Affiliations

  1. Westwood Associates, USA

    Happy T. Holden

  2. IBM Microelectronics, USA

    Donald Barr & Douglas Powell

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  1. Happy T. Holden
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  2. Donald Barr
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  3. Douglas Powell
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Karl J. Puttlitz Paul A. Totta

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Holden, H.T., Barr, D., Powell, D. (2001). Laminate/HDI Die Carriers. In: Puttlitz, K.J., Totta, P.A. (eds) Area Array Interconnection Handbook. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-1389-6_7

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