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Ceramic Chip Carriers

  • John U. Knickerbocker
  • Thomas F. Redmond

Abstract

Ceramic chip carriers which utilize area-array interconnections have been used in industry applications for over 30 years. This chapter provides ceramic chip carrier examples for each of the six market applications which include High Performance, Cost Performance, Commodity, Hand Held and Communication, Automotive and Memory. Materials and properties are summarized for standard alumina chip carriers, high-performance materials, thin-film materials, and high-thermal-performance materials. Fabrication processes include comparisons for thick film, dry pressed and multilayer ceramics with and without advanced thin-film wiring. Thin-film wiring provides the highest level of wiring for both Single Chip Modules (SCM) and Multi-chip Modules (MCM). Relative comparisons are also made for availability, cost, characteristics and various application form factors.

Keywords

Ball Grid Array Chip Carrier Multichip Module Ceramic Carrier Blank Carrier 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2001

Authors and Affiliations

  • John U. Knickerbocker
    • 1
  • Thomas F. Redmond
    • 1
  1. 1.IBM MicroelectronicsUSA

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