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Fundamental Aspects of Polymer Metallization

  • Chapter
Metallization of Polymers 2

Abstract

Metallized plastics are used extensively in applications ranging from food packing to microelectronics1,2. Particularly the latter field has stimulated intensive research throughout the last decades1–6. In view of the great need for further miniaturization and reduction of propagation delay in future device generations aluminum will increasingly be replaced by the lower resistivity copper, and polymers are seen as potential low-permittivity (low-k) dielectrics even for on-chip interconnect5,6. First chips involving Cu and the polymer SiLK® (DuPont7) have already been fabricated by IBM8.

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Authors and Affiliations

  1. Lehrstuhl für Materialverbunde, Technische Fakultät der Universität Kiel, Kaiserstr. 2, 24143, Kiel, Germany

    F. Faupel, V. Zaporojtchenko, J. Erichsen & K. Dolgner

  2. Ruhr-Universität Bochum, Germany

    T. Strunskus

  3. Universität Hamburg, Germany

    A. Thran

  4. AMD Inc., USA

    M. Kiene

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  1. F. Faupel
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  1. École Polytechnique, Montréal, Québec, Canada

    Edward Sacher

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Faupel, F. et al. (2002). Fundamental Aspects of Polymer Metallization. In: Sacher, E. (eds) Metallization of Polymers 2. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-0563-1_8

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