Abstract
The architectural construction of an electronic system from individual integrated circuits (ICs) and other components is dependent upon effective interconnection substrates and means of connecting to them (chip-to-module connections). Traditionally, general packaging, assembly, and chip-to-module connections were available and applied to devices. A close interaction between IC design and substrate technology was not required. Early ICs used transistor-transistor logic which had long internal delays (e.g. 15 ns) making the interconnect and module delays irrelevant. The number of input and output (I/O) connections was small, the DC power was minimal, and packaging density of silicon on boards was sparse. This made cost, reliability, and yield the focus of the chip-to-module connection technology.
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Kohl, P. (2003). Chip-to-Module Interconnections. In: Davis, J., Meindl, J.D. (eds) Interconnect Technology and Design for Gigascale Integration. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-0461-0_8
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DOI: https://doi.org/10.1007/978-1-4615-0461-0_8
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