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Packaging Technologies for Flexible Systems

  • Christine Kallmayer
Part of the Emerging Technology in Advanced Packaging Series book series (ADEP, volume 1)

Abstract

The overall drive to smaller and lighter packages together with a continuously increasing I/O count has lead to an increase in interest in flexible substrates for electronic packaging. With the growing number of applications for flexible modules the variety of requirements for these packages increased as well. Different technologies had to be developed to meet the needs of products ranging from CSP’s over Smart Cards to complex systems e.g. medical implants. Different soldering techniques as well as adhesive joining processes have been optimized and qualified for flexible substrates. Simultaneously the development of thin flexible dies provided a key technology for flexible systems.

Keywords

Solder Joint Smart Card Flexible Substrate Flip Chip Eutectic PbSn 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2003

Authors and Affiliations

  • Christine Kallmayer
    • 1
  1. 1.Fraunhofer IZMBerlinGermany

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